Reliability of RoHS-Compliant 2D and 3D IC interconnects /

"Unique global coverage of RoHS-compliant materials for electronics manufacturing and for packaging assembly and semiconductor integration Reliability of RoHS-Compliant 2D and 3D IC Interconnects provides comprehensive details on RoHS-compliant electronics packaging solder interconnects. This a...

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Bibliographic Details

Main Author:	Lau, John H. (Author)
Corporate Author:	McGraw-Hill Companies
Format:	eBook
Language:	English
Language Notes:	In English.
Published:	New York, N.Y. : McGraw-Hill Education, [2011]
Edition:	First edition.
Series:	McGraw-Hill's AccessEngineering.
Subjects:	Interconnects (Integrated circuit technology) > Reliability. Green technology > Reliability. Electronic books.
Online Access:	Connect to the full text of this electronic book