Cover Image

Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition /

Bibliographic Details
Main Author: Tummala, Rao (Author)
Corporate Author: McGraw-Hill Companies
Format: eBook
Language:English
Language Notes:In English.
Published: New York, N.Y. : McGraw-Hill Education, [2019].
Edition:2nd edition.
Subjects:
Microelectronic packaging.
TECHNOLOGY & ENGINEERING / Electrical.
Electronic books.
Online Access:Connect to the full text of this electronic book
Table of Contents:
  • Cover
  • Title Page
  • Copyright Page
  • Dedication
  • Contents
  • Contributors
  • Preface
  • 1 Introduction to Device and Systems Packaging Technologies
  • 1.1 What Is Packaging and Why?
  • 1.2 Anatomy of an Electronic Packaged System from a Packaging Point of View
  • 1.3 Devices and Moore?s Law
  • 1.4 Electronic Technology Waves: Microelectronics, RF/Wireless, Photonics, MEMS, and Quantum Devices
  • 1.5 Packaging and Moore?s Law for Packaging
  • 1.6 Electronic Systems Technologies Trends
  • 1.7 Future Outlook
  • 1.8 How the Book Is Organized
  • 1.9 Homework Problems
  • 1.10 Suggested Reading
  • Part 1 Fundamentals of Packaging
  • 2 Fundamentals of Electrical Design for Signals, Power, and Electromagnetic Interference
  • 3 Fundamentals of Thermal Technologies
  • 4 Fundamentals of Thermo-Mechanical Reliability
  • 5 Fundamentals of Package Materials at Microscale and Nanoscale
  • 6 Fundamentals of Ceramic, Organic, Glass, and Silicon Package Substrates
  • 7 Fundamentals of Passive Components and Integration with Active Devices
  • 8 Fundamentals of Chip-to-Package Interconnections and Assembly
  • 9 Fundamentals of Embedded and Fan-Out Packaging
  • 10 Fundamentals of 3D Packaging with and without TSV
  • 11 Fundamentals of RF and Millimeter-Wave Packaging
  • 12 Fundamentals of Optoelectronics Packaging
  • 13 Fundamentals of MEMS and Sensor Packaging
  • 14 Fundamentals of Package Encapsulation, Molding, and Sealing
  • 15 Fundamentals of Printed Wiring Boards
  • 16 Fundamentals of Board Assembly
  • Part 2 Applications of Packaging Technologies
  • 17 Applications of Packaging Technologies in Future Car Electronics
  • 18 Applications of Packaging Technologies in Bioelectronics
  • 19 Applications of Packaging Technologies in Communication Systems
  • 20 Applications of Packaging Technologies in Computing Systems
  • 21 Applications of Packaging Technologies in Flexible Electronics
  • 22 Applications of Packaging Technologies in Smartphones
  • Index.