Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition /

Bibliographic Details

Main Author:	Tummala, Rao (Author)
Corporate Author:	McGraw-Hill Companies
Format:	eBook
Language:	English
Language Notes:	In English.
Published:	New York, N.Y. : McGraw-Hill Education, [2019].
Edition:	2nd edition.
Subjects:	Microelectronic packaging. TECHNOLOGY & ENGINEERING / Electrical. Electronic books.
Online Access:	Connect to the full text of this electronic book