Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition /

Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : high performance compute and system-in-package /
Published: (2021)

Force sensors for microelectronic packaging applications /
by: Schwizer, Jürg
Published: (2005)

Microelectronic packaging /
Published: (2005)

New technology in electronic packaging : proceedings of ASM International's 3rd Electronic Materials & Processing Congress, San Francisco, California, USA, 20-23 August 1990 /
Published: (1990)

Microwave and millimeter-wave electronic packaging /
by: Sturdivant, Rick
Published: (2014)

Area array packaging handbook /
by: Gilleo, Ken
Published: (2002)

Microwave and millimeter-wave electronic packaging /
by: Sturdivant, Rick
Published: (2014)

Fundamentals of microsystems packaging /
Published: (2001)

Thermomechanical simulation methodologies for advanced semiconductor packaging /
by: Zhang, Shuye (Associate professor), et al.
Published: (2025)

Thermomechanical simulation methodologies for advanced semiconductor packaging /
by: Zhang, Shuye (Associate professor), et al.
Published: (2025)

Thermomechanical simulation methodologies for advanced semiconductor packaging /
by: Zhang, Shuye (Associate professor), et al.
Published: (2025)

Fundamentals of microsystems packaging /
Published: (2001)

Proceedings of the 1997 1st Electronic Packaging Technology Conference /
Published: (1997)

Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing /
by: Liu, S. (Sheng), 1963-
Published: (2011)

Proceedings : 1997 International Systems Packaging Symposium, December 2-5, 1997, Sheraton San Diego Hotel & Marina, Harbor Island, San Diego, California /
Published: (1997)

Foldable flex and thinned silicon multichip packaging technology /
Published: (2003)

Multichip modules : systems advantages, major constructions, and materials technologies /
Published: (1991)

MEMS/MOEMS packaging : concepts, designs, metarials, and processes /
by: Gilleo, Ken
Published: (2005)

Electronics packaging forum : multichip module technology issues /
Published: (1994)

Copper interconnect technology /
by: Steinbruchel, Christoph
Published: (2001)

Proceedings : 1999 International Conference on High Density Packaging and MCMs, April 6-9, 1999, the Adam's Mark Hotel, Denver, Colorado /
Published: (1999)

Hermeticity testing of MEMS and microelectronic packages /
by: Costello, Suzanne, et al.
Published: (2013)

Thermal stress and strain in microelectronics packaging /
Published: (1993)

Hermeticity of electronic packages /
by: Greenhouse, Hal
Published: (2012)

Sensing, modeling, and simulation in emerging electronic packaging : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia /
Published: (1996)

International Conference and Exhibition on Multichip Modules : [proceedings].

Proceedings of the technical program /

Proceedings of the technical conference /
Published: (1983)

Proceedings of the technical program.

Electronic and photonic packaging, Integration and packaging of micro/nano/electronic systems--2005 : presented at 2005 ASME International Mechanical Engineering Congress and Exposition : November 5-11, 2005, Orlando, Florida, USA /
Published: (2005)

Area array packaging handbook /
by: Gilleo, Ken
Published: (2002)

Hermeticity of electronic packages /
by: Greenhouse, Hal
Published: (2000)

Plastic packaging of microelectronic devices /
by: Manzione, Louis T.
Published: (1990)

Electronic and photonics packaging : Multi-Scale Electrical and Mechanical Systems--2006 presented at 2006 ASME International Mechanical Engineering Congress and Exposition : November 5-10, 2006, Chicago, Illinois, USA /
Published: (2007)

Portable consumer electronics : packaging, materials, and reliability /
by: Canumalla, Sridhar
Published: (2010)

Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology : presented at the 2002 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 2002, New Orleans, Louisiana /
Published: (2002)