Cover Image

Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition /

Bibliographic Details
Main Author: Tummala, Rao (Author)
Corporate Author: McGraw-Hill Companies
Format: eBook
Language:English
Language Notes:In English.
Published: New York, N.Y. : McGraw-Hill Education, [2019].
Edition:2nd edition.
Subjects:
Microelectronic packaging.
TECHNOLOGY & ENGINEERING / Electrical.
Electronic books.
Online Access:Connect to the full text of this electronic book
Description
Physical Description:1 online resource (849 pages) : 550 illustrations.
Also available in print edition.
Format:Mode of access: Internet via World Wide Web.
Bibliography:Includes bibliographical references and index.
ISBN:9781259861567 (e-ISBN)
1259861562 (e-ISBN)
9781259861550 (print-ISBN)
1259861554 (print-ISBN)