Tummala, R. (2019). Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition (2nd edition.). McGraw-Hill Education.
Chicago Style (17th ed.) CitationTummala, Rao. Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition. 2nd edition. New York, N.Y.: McGraw-Hill Education, 2019.
MLA (9th ed.) CitationTummala, Rao. Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition. 2nd edition. McGraw-Hill Education, 2019.
Warning: These citations may not always be 100% accurate.