Introduction to system-on-package (SOP) : miniaturization of the entire system /

"System-on-Package (SOP) is an emerging system technology that goes beyond System-on-Chip (SOC) and System-in-Package (SIP) and forms the basis of all emerging digital convergent electronic and bioelectric systems. This book on SOP shows designers how this revolutionary new packaging technology...

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Bibliographic Details

Main Author:	Tummala, Rao R., 1942- (Author)
Corporate Author:	McGraw-Hill Companies
Other Authors:	Swaminathan, Madhavan, Bandyopadhyay, Tapobrata, Mehendale, Mahesh, Rao, Jagdish, Lee, Baik-Woo, Yoon, Chong K., Brown, Kenneth M., Engin, A. Ege, Govind, Vinu, Bavisi, Amit, Papapolymerou, John, Tentzeris, Manos, Laskar, Joy, Bhattacharya, Swapan, Chang, Gee-Kung, Gaylord, Thomas, Vallalaz, Ricardo, Guidotti, Daniel, Chen, Ray T., Sundaram, Venky, Liu, Fuhan, Krishnan, Ganesh, White, George, Kohl, Paul, Raj, P. Markondeya, Pucha, Raghuram V., Qu, Jianmin, Sitaraman, Suresh K., Monajemi, Pejman, Ayazi, Farrokh, Sparks, Douglas, Zhang, Zhuqing, Li , Y., Wong, C. P., Joshi, Y., Jha, Gopal C., Patterson, M., Dutta, P., Akbay, S. S., Keezer, D., Chatterjee, A., Janagama, Dasharathan G., Liu, Jin, Iyer, Mahadevan K.
Format:	eBook
Language:	English
Language Notes:	In English.
Published:	New York, N.Y. : McGraw-Hill Education, [2008]
Edition:	First edition.
Series:	McGraw-Hill's AccessEngineering.
Subjects:	Multichip modules (Microelectronics) > Design and construction. Microelectronic packaging. Electronic books.
Online Access:	Connect to the full text of this electronic book