"System-on-Package (SOP) is an emerging system technology that goes beyond System-on-Chip (SOC) and System-in-Package (SIP) and forms the basis of all emerging digital convergent electronic and bioelectric systems. This book on SOP shows designers how this revolutionary new packaging technology...
Bibliographic Details
| Main Author: |
Tummala, Rao R., 1942-
(Author) |
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| Corporate Author: |
McGraw-Hill Companies |
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| Other Authors: |
Swaminathan, Madhavan,
Bandyopadhyay, Tapobrata,
Mehendale, Mahesh,
Rao, Jagdish,
Lee, Baik-Woo,
Yoon, Chong K.,
Brown, Kenneth M.,
Engin, A. Ege,
Govind, Vinu,
Bavisi, Amit,
Papapolymerou, John,
Tentzeris, Manos,
Laskar, Joy,
Bhattacharya, Swapan,
Chang, Gee-Kung,
Gaylord, Thomas,
Vallalaz, Ricardo,
Guidotti, Daniel,
Chen, Ray T.,
Sundaram, Venky,
Liu, Fuhan,
Krishnan, Ganesh,
White, George,
Kohl, Paul,
Raj, P. Markondeya,
Pucha, Raghuram V.,
Qu, Jianmin,
Sitaraman, Suresh K.,
Monajemi, Pejman,
Ayazi, Farrokh,
Sparks, Douglas,
Zhang, Zhuqing,
Li , Y.,
Wong, C. P.,
Joshi, Y.,
Jha, Gopal C.,
Patterson, M.,
Dutta, P.,
Akbay, S. S.,
Keezer, D.,
Chatterjee, A.,
Janagama, Dasharathan G.,
Liu, Jin,
Iyer, Mahadevan K. |
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| Format: | eBook
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| Language: | English |
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| Language Notes: | In English. |
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| Published: |
New York, N.Y. :
McGraw-Hill Education,
[2008]
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| Edition: | First edition. |
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| Series: | McGraw-Hill's AccessEngineering.
|
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| Subjects: | |
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| Online Access: | Connect to the full text of this electronic book
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