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Microvias : for low-cost, high-density interconnects /

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Annotation.

Bibliographic Details
Main Author: Lau, John H. (Author)
Corporate Author: McGraw-Hill Companies
Other Authors: Lee, S. W. Ricky
Format: eBook
Language:English
Language Notes:In English.
Published: New York, N.Y. : McGraw-Hill Education, [2001]
Edition:First edition.
Series:McGraw-Hill's AccessEngineering.
Subjects:
Microelectronic packaging.
Multichip modules (Microelectronics)
Flip chip technology.
Printed circuits.
Drilling and boring.
Micro-drilling.
Microelectronics > Materials.
Solder and soldering.
Solder and soldering > Testing.
Microelectronics packaging > Reliability.
Multichip modules (Microelectronics) > Testing.
Integrated circuits > Design and construction > Cost control.
Semiconductors > Junctions.
Electronic books.
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by Lau, John H.
Published 2001
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by Lau, John H.
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