Microvias : for low-cost, high-density interconnects /

Annotation.

Bibliographic Details
Main Author:	Lau, John H. (Author)
Corporate Author:	McGraw-Hill Companies
Other Authors:	Lee, S. W. Ricky
Format:	eBook
Language:	English
Language Notes:	In English.
Published:	New York, N.Y. : McGraw-Hill Education, [2001]
Edition:	First edition.
Series:	McGraw-Hill's AccessEngineering.
Subjects:	Microelectronic packaging. Multichip modules (Microelectronics) Flip chip technology. Printed circuits. Drilling and boring. Micro-drilling. Microelectronics > Materials. Solder and soldering. Solder and soldering > Testing. Microelectronics packaging > Reliability. Multichip modules (Microelectronics) > Testing. Integrated circuits > Design and construction > Cost control. Semiconductors > Junctions. Electronic books.
Online Access:	Connect to the full text of this electronic book

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