Wire bonding in microelectronics /

Bibliographic Details
Main Author:	Harman, George G.
Corporate Author:	McGraw-Hill Companies
Format:	eBook
Language:	English
Published:	New York : McGraw-Hill, [2010]
Edition:	3rd ed.
Series:	McGraw-Hill's AccessEngineering.
Subjects:	Wire bonding (Electronic packaging) > Production control. Electronic packaging > Reliability. Electronic packaging > Defects. Semiconductors > Failures. Electronic books. Internet resources.
Online Access:	Connect to the full text of this electronic book

Description
Item Description:	Print version c2010. Previous edition: 1997; first published as: Reliability and yield problems of wire bonding in microelectronics. 1989.
Physical Description:	1 online resource(xx, 426 pages) : illustrations. Also issued in print and PDF versions.
Bibliography:	Includes bibliographical references and index.
ISBN:	9780071476232 9780071703345