Wire bonding in microelectronics /

Bibliographic Details
Main Author:	Harman, George G.
Corporate Author:	McGraw-Hill Companies
Format:	eBook
Language:	English
Published:	New York : McGraw-Hill, [2010]
Edition:	3rd ed.
Series:	McGraw-Hill's AccessEngineering.
Subjects:	Wire bonding (Electronic packaging) > Production control. Electronic packaging > Reliability. Electronic packaging > Defects. Semiconductors > Failures. Electronic books. Internet resources.
Online Access:	Connect to the full text of this electronic book

Available Online