Area array packaging handbook /

"Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC). Details the pros and cons of each technology with varying applications. Examines packaging ramifications of hi...

Full description

Bibliographic Details
Main Author:	Gilleo, Ken (Author)
Corporate Authors:	McGraw-Hill Companies, Prismark Partners LLC
Other Authors:	Lasky, Ronald. C., Morvan, Y., Smith, Lee, Fjelstad, Joseph, Yasumura, Gary, Kim, Young Gon, Randolph, Steve, Sanders, John, Cole, Marie S., Bates, Bill, Chen, Tim, Cotterman, Bruce, Garrett, Dave, Mohanty, Rita, Perry, John, Preveti, Mike, Lee, Jacob, Minogue, Gerard, Hwang, Jennie S., Rae, Alan, Blumel, David, Baldwin, Daniel F., Johnson, R. Wayne, Wood, Paul, Rupprecht, Howard, Ghaffarian, Raza, Lazinsky, C., Belmonte, Joe, Schiebel, Gunter, Apell, Marc, McLenaghan, A. James, Lewis, Brian, Jiang, Nan, Travers, Joseph, Anderson, Steve, Zarrow, Phil
Format:	eBook
Language:	English
Language Notes:	In English.
Published:	New York, N.Y. : McGraw-Hill Education, [2002]
Edition:	First edition.
Series:	McGraw-Hill's AccessEngineering.
Subjects:	Ball grid array technology. Microelectronic packaging. Electronics industries. Electronic packaging. Integrated circuits industry. Flip chip technology. Polymers. Electronics > Materials. Hermetic sealing. Adhesives. Solder and soldering. Multichip modules (Microelectronics) > Testing. Screen process printing. Software measurement. Electronic apparatus and appliances > Costs. Surface mount technology. Electronic books.
Online Access:	Connect to the full text of this electronic book

Description
Summary:	"Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC). Details the pros and cons of each technology with varying applications. Examines packaging ramifications of high density interconnects (HDI)" Annotation Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI).
Item Description:	Print version c2002.
Physical Description:	1 online resource (1000 pages) : illustrations. Also available in print edition.
Format:	Mode of access: Internet via World Wide Web.
Bibliography:	Includes bibliographical references and index.
ISBN:	0071449450 0071374930 (print-ISBN) 9780071374934