Area array packaging handbook /

"Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC). Details the pros and cons of each technology with varying applications. Examines packaging ramifications of hi...

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Bibliographic Details
Main Author: Gilleo, Ken (Author)
Corporate Authors: McGraw-Hill Companies, Prismark Partners LLC
Other Authors: Lasky, Ronald. C., Morvan, Y., Smith, Lee, Fjelstad, Joseph, Yasumura, Gary, Kim, Young Gon, Randolph, Steve, Sanders, John, Cole, Marie S., Bates, Bill, Chen, Tim, Cotterman, Bruce, Garrett, Dave, Mohanty, Rita, Perry, John, Preveti, Mike, Lee, Jacob, Minogue, Gerard, Hwang, Jennie S., Rae, Alan, Blumel, David, Baldwin, Daniel F., Johnson, R. Wayne, Wood, Paul, Rupprecht, Howard, Ghaffarian, Raza, Lazinsky, C., Belmonte, Joe, Schiebel, Gunter, Apell, Marc, McLenaghan, A. James, Lewis, Brian, Jiang, Nan, Travers, Joseph, Anderson, Steve, Zarrow, Phil
Format: eBook
Language:English
Language Notes:In English.
Published: New York, N.Y. : McGraw-Hill Education, [2002]
Edition:First edition.
Series:McGraw-Hill's AccessEngineering.
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Call Number: TK7870.15
 
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