Thermal management materials for electronic packaging : preparation, characterization, and devices /

Thermal Management Materials for Electronic Packaging Practical resource exploring the theoretical and experimental basis as well as solutions for the development of new thermal management materials for electronic packaging Thermal Management Materials for Electronic Packaging: Preparation, Characte...

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Bibliographic Details
Other Authors: Tian, Xingyou (Editor)
Format: eBook
Language:English
Published: Weinheim, Germany : Wiley-VCH, 2024.
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Call Number: TK7870.15 .T44 2024
 
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TK7870.15 .T44 2024 Available