Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : high performance compute and system-in-package /

Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an...

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Bibliographic Details

Other Authors:	Keser, Beth, 1971- (Editor), Kröhnert, Steffen (Editor)
Format:	eBook
Language:	English
Published:	Newark : John Wiley & Sons, Incorporated, 2021.
Series:	IEEE Press series.
Subjects:	Microelectronic packaging.
Online Access:	Connect to the full text of this electronic book