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3D IC and RF SiPs : advanced stacking and planar solutions for 5G mobility /

Bibliographic Details
Main Authors: Hwang, Lih-Tyng (Author), Horng, Tzyy-sheng Jason (Author)
Format: eBook
Language:English
Published: Hoboken, NJ : John Wiley & Sons, 2018.
Edition:1st edition.
Subjects:
Mobile communication systems > Technological innovations.
Electronic books.
Online Access:Connect to the full text of this electronic book
Description
Physical Description:1 online resource
Bibliography:Includes bibliographical references and index.
ISBN:9781119289678
111928967X
9781119289661
1119289661
9781119289654
1119289653