3D IC and RF SiPs : advanced stacking and planar solutions for 5G mobility /

Bibliographic Details
Main Authors:	Hwang, Lih-Tyng (Author), Horng, Tzyy-sheng Jason (Author)
Format:	eBook
Language:	English
Published:	Hoboken, NJ : John Wiley & Sons, 2018.
Edition:	1st edition.
Subjects:	Mobile communication systems > Technological innovations. Electronic books.
Online Access:	Connect to the full text of this electronic book

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