APA (7th ed.) Citation

Keser, B., & Kroehnert, S. (2019). Advances in embedded and fan-out wafer level packaging technologies. John Wiley & Sons, Inc..

Chicago Style (17th ed.) Citation

Keser, Beth, and Steffen Kroehnert. Advances in Embedded and Fan-out Wafer Level Packaging Technologies. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2019.

MLA (9th ed.) Citation

Keser, Beth, and Steffen Kroehnert. Advances in Embedded and Fan-out Wafer Level Packaging Technologies. John Wiley & Sons, Inc., 2019.