Advances in embedded and fan-out wafer level packaging technologies /

Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging "FO-WLP" technologies have been developed across the industry over the...

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Bibliographic Details

Other Authors:	Keser, Beth, 1971- (Editor), Kroehnert, Steffen, 1970- (Editor)
Format:	eBook
Language:	English
Published:	Hoboken, NJ, USA : John Wiley & Sons, Inc., 2019.
Subjects:	Chip scale packaging. Integrated circuits > Wafer-scale integration.
Online Access:	Connect to the full text of this electronic book