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SiP-system in package design and simulation : Mentor EE Flow Advanced Design Guide /

An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cav...

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Bibliographic Details
Main Author: Li, Suny, 1974- (Author)
Format: eBook
Language:English
Published: Singapore ; Hoboken, NJ : Publishing House of Electronics Industry/Wiley, 2017.
Subjects:
Integrated circuits > Design and construction.
Multichip modules (Microelectronics) > Design and construction.
Electronic books.
Online Access:Connect to the full text of this electronic book
Table of Contents:
  • SiP design and simulation platform
  • Basic knowledge of package
  • SiP production process
  • New package technologies
  • SiP design and simulation flow
  • Central library
  • Schematic input
  • Multi-board project management and schematic concurrent design
  • Layout creation and setting
  • Constraint rules management
  • Wire bond design
  • Cavity and chip stack design
  • FlipChip and RDL design
  • Route and plane
  • Embedded passives design
  • RF circuit design
  • Layout concurrent design
  • 3D real-time DRC
  • Design review
  • Manufacture data output
  • SiP simulation technology.