SiP-system in package design and simulation : Mentor EE Flow Advanced Design Guide /

An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cav...

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Bibliographic Details

Main Author:	Li, Suny, 1974- (Author)
Format:	eBook
Language:	English
Published:	Singapore ; Hoboken, NJ : Publishing House of Electronics Industry/Wiley, 2017.
Subjects:	Integrated circuits > Design and construction. Multichip modules (Microelectronics) > Design and construction. Electronic books.
Online Access:	Connect to the full text of this electronic book