Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing /
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
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| Format: | eBook |
| Language: | English |
| Published: |
[Beijing] : Singapore :
Chemical Industry Press ; Wiley,
2011.
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| Online Access: | Connect to the full text of this electronic book |
| Summary: | "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"-- |
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| Physical Description: | 1 online resource (xxii, 564 pages) : illustrations |
| Bibliography: | Includes bibliographical references and index. |
| ISBN: | 0470827815 9780470827819 9780470827826 0470827823 9780470828410 0470828412 9781118082829 1118082826 |