Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing /

"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--

Bibliographic Details

Main Author:	Liu, S. (Sheng), 1963-
Other Authors:	Liu, Yong, 1962-
Format:	eBook
Language:	English
Published:	[Beijing] : Singapore : Chemical Industry Press ; Wiley, 2011.
Subjects:	Microelectronic packaging > Simulation methods.
Online Access:	Connect to the full text of this electronic book