APA (7th ed.) Citation

Liu, S., & Liu, Y. (2011). Modeling and simulation for microelectronic packaging assembly: Manufacturing, reliability, and testing. Chemical Industry Press ; Wiley.

Chicago Style (17th ed.) Citation

Liu, S., and Yong Liu. Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability, and Testing. [Beijing] : Singapore: Chemical Industry Press ; Wiley, 2011.

MLA (9th ed.) Citation

Liu, S., and Yong Liu. Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability, and Testing. Chemical Industry Press ; Wiley, 2011.