APA (7th ed.) Citation

Bamberg, L., Joseph, J. M., García-Ortiz, A., & Pionteck, T. (2022). 3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization (1st ed. 2022.). Springer International Publishing : Imprint: Springer. https://doi.org/10.1007/978-3-030-98229-4

Chicago Style (17th ed.) Citation

Bamberg, Lennart, Jan Moritz Joseph, Alberto García-Ortiz, and Thilo Pionteck. 3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization. 1st ed. 2022. Cham: Springer International Publishing : Imprint: Springer, 2022. https://doi.org/10.1007/978-3-030-98229-4.

MLA (9th ed.) Citation

Bamberg, Lennart, et al. 3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization. 1st ed. 2022. Springer International Publishing : Imprint: Springer, 2022. https://doi.org/10.1007/978-3-030-98229-4.