3D Interconnect Architectures for Heterogeneous Technologies : Modeling and Optimization /

This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D...

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Bibliographic Details

Main Authors:	Bamberg, Lennart (Author), Joseph, Jan Moritz (Author), García-Ortiz, Alberto (Author), Pionteck, Thilo (Author)
Corporate Author:	SpringerLink (Online service)
Format:	eBook
Language:	English
Published:	Cham : Springer International Publishing : Imprint: Springer, 2022.
Edition:	1st ed. 2022.
Subjects:	Electronic circuits. Embedded computer systems. Microprocessors. Computer architecture. Electronic Circuits and Systems. Embedded Systems. Processor Architectures. Electronic books.
Online Access:	Connect to the full text of this electronic book