Harsh environment electronics : interconnect materials and performance assessment /
Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barrie...
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| Format: | eBook |
| Language: | English |
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Weinheim, Germany :
Wiley-VCH Verlag GmbH and Company,
[2019]
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| Online Access: | Connect to the full text of this electronic book |
Internet
Connect to the full text of this electronic bookAvailable Online
| Call Number: |
TK7871 |
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| Call Number | Status | Get It |
| TK7871 | Available | |