Encapsulation technologies for electronic applications /

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D...

Full description

Bibliographic Details
Main Authors: Ardebili, Haleh (Author), Zhang, Jiawei (Author), Pecht, Michael (Author)
Corporate Author: Knovel (Firm)
Format: eBook
Language:English
Published: Oxford, United Kingdom : William Andrew, [2019]
Edition:Second edition.
Series:Materials and processes for electronic applications series.
Subjects:
Online Access:Connect to the full text of this electronic book
Search Result 2
by Ardebili, Haleh
Published 2009
Book
Search Result 3
Search Result 4