Encapsulation technologies for electronic applications /

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D...

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Bibliographic Details

Main Authors:	Ardebili, Haleh (Author), Zhang, Jiawei (Author), Pecht, Michael (Author)
Corporate Author:	Knovel (Firm)
Format:	eBook
Language:	English
Published:	Oxford, United Kingdom : William Andrew, [2019]
Edition:	Second edition.
Series:	Materials and processes for electronic applications series.
Subjects:	Electronic apparatus and appliances > Plastic embedment. Encapsulation (Électronique) TECHNOLOGY & ENGINEERING > Mechanical. Electronic books.
Online Access:	Connect to the full text of this electronic book