Microwave and millimeter-wave electronic packaging /

Presenting the packaging issues which are unique to microwave and millimeter-wave frequencies, this book reviews lower frequency packaging techniques and how they can be tailored or analyzed for higher frequency designs. --

Bibliographic Details

Main Author:	Sturdivant, Rick (Author)
Corporate Author:	Knovel (Firm)
Format:	eBook
Language:	English
Published:	Boston [Massachusetts] ; London [England] : Artech House, 2014.
Series:	Artech House microwave library.
Subjects:	Microelectronic packaging. Mise sous boîtier (Microélectronique) TECHNOLOGY & ENGINEERING > Mechanical. Electronic books.
Online Access:	Connect to the full text of this electronic book