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Hermeticity testing of MEMS and microelectronic packages /

Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mecha...

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Bibliographic Details
Main Authors: Costello, Suzanne (Author), Desmulliez, Marc P. Y., 1963- (Author)
Corporate Author: Knovel (Firm)
Format: eBook
Language:English
Language Notes:English.
Published: Boston : Artech House, [2013]
Series:Artech House integrated microsystems series.
Subjects:
Microelectronic packaging > Testing.
Microelectromechanical systems > Testing.
Hermetic sealing > Testing.
Microelectronics > Testing.
Electronic books.
Online Access:Connect to the full text of this electronic book

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