Hermeticity testing of MEMS and microelectronic packages /

Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mecha...

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Bibliographic Details

Main Authors:	Costello, Suzanne (Author), Desmulliez, Marc P. Y., 1963- (Author)
Corporate Author:	Knovel (Firm)
Format:	eBook
Language:	English
Language Notes:	English.
Published:	Boston : Artech House, [2013]
Series:	Artech House integrated microsystems series.
Subjects:	Microelectronic packaging > Testing. Microelectromechanical systems > Testing. Hermetic sealing > Testing. Microelectronics > Testing. Electronic books.
Online Access:	Connect to the full text of this electronic book