Hermeticity testing of MEMS and microelectronic packages /
Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mecha...
| Main Authors: | , |
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| Corporate Author: | |
| Format: | eBook |
| Language: | English |
| Language Notes: | English. |
| Published: |
Boston :
Artech House,
[2013]
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| Series: | Artech House integrated microsystems series.
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| Subjects: | |
| Online Access: | Connect to the full text of this electronic book |
| Summary: | Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required. This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book inches. |
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| Physical Description: | 1 online resource (195 pages .) |
| Bibliography: | Includes bibliographical references and index. |
| ISBN: | 9781608075287 1608075281 9781523117284 1523117281 |