3D Microelectronic Packaging : From Architectures to Applications /

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research...

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Bibliographic Details

Corporate Author:	SpringerLink (Online service)
Other Authors:	Li, Yan (Editor), Goyal, Deepak (Editor)
Format:	eBook
Language:	English
Published:	Singapore : Springer Singapore : Imprint: Springer, 2021.
Edition:	2nd ed. 2021.
Series:	Springer Series in Advanced Microelectronics, 64
Subjects:	Electronic circuits. Electronics. Microelectronics. Optical materials. Electronic materials. Biotechnology. Nanotechnology. Metals. Electronic Circuits and Devices. Electronics and Microelectronics, Instrumentation. Optical and Electronic Materials. Microengineering. Nanotechnology and Microengineering. Metallic Materials. Electronic books.
Online Access:	Connect to the full text of this electronic book