Semiconductor Advanced Packaging /

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on...

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Bibliographic Details

Main Author:	Lau, John H. (Author)
Corporate Author:	SpringerLink (Online service)
Format:	eBook
Language:	English
Published:	Singapore : Springer Singapore : Imprint: Springer, 2021.
Edition:	1st ed. 2021.
Subjects:	Electronics. Microelectronics. Semiconductors. Industrial engineering. Production engineering. Electronics and Microelectronics, Instrumentation. Industrial and Production Engineering. Electronic books.
Online Access:	Connect to the full text of this electronic book