Wireless interface technologies for 3D IC and module integration /

Through silicon vias : materials, models, design, and performance /
by: Kaushik, Brajesh Kumar
Published: (2017)

Interconnect-centric design for advanced SoC and NoC /
Published: (2004)

Copper interconnect technology /
by: Gupta, Tapan
Published: (2009)

Interconnect noise optimization in nanometer technologies /
by: Elgamel, Mohamed A.
Published: (2006)

Advanced interconnects for ULSI technology /
Published: (2012)

Die-stacking architecture /
by: Xie, Yuan, 1973-, et al.
Published: (2015)

IC interconnect analysis /
by: Celik, Mustafa, 1966-
Published: (2002)

Advanced Ta-based diffusion barriers for Cu interconnects /
by: Hübner, René
Published: (2009)

High speed VCSELs for optical interconnects /
by: Mutig, Alex
Published: (2011)

Recent advances in dielectric materials /
Published: (2009)

Reliability of RoHS-Compliant 2D and 3D IC interconnects /
by: Lau, John H.
Published: (2011)

3D IC devices, technologies, and manufacturing /
by: Xiao, Hong, 1961-
Published: (2016)

Three-dimensional molded interconnect devices (3D-MID) : materials, Manufacturing, assembly, and applications for injection molded circuit carriers /
by: Franke, Jörg, Dipl.-Ing
Published: (2014)

Interconection noise in VLSI circuits /
by: Moll, Francesc
Published: (2004)

Electronic, Magnetic and Photonic Materials Division Symposium : advanced metallizations and interconnect technologies, in honor of Prof. K.N. Tu's 70th birthday /
Published: (2007)

Fundamentals of reliability engineering : applications in multistage interconnection networks /
by: Gunawan, Indra
Published: (2014)

Interconnect technology and design for gigascale integration /
Published: (2003)

High-speed photonics interconnects /
Published: (2013)

Chemical-mechanical polishing of low dielectric constant polymers and organosilicate glasses : fundamental mechanisms and application to IC interconnect technology /
by: Borst, Christopher L. (Christopher Lyle)
Published: (2002)

3D IC integration and packaging /
by: Lau, John H.
Published: (2016)

Photonic interconnects for computing systems : understanding and pushing design challenges /
Published: (2017)

Integrated interconnect technologies for 3D nanoelectronic systems /
Published: (2009)

Interconnect-centric design for advanced SoC and NoC /
Published: (2004)

RapidIO : the embedded system interconnect /
by: Fuller, Samuel H., 1946-
Published: (2005)

RapidIO : the embedded system interconnect /
by: Fuller, Samuel H., 1946-
Published: (2005)

A one-semester course in modeling of VLSI interconnections /
by: Goel, Ashok K., 1953-
Published: (2015)

Introduction to metrology applications in IC manufacturing /
by: Bo, Su, et al.
Published: (2015)

Materials and processes for advanced interconnects for microelectronics : March 24-28, 2008, San Francisco, California, USA.
Published: (2008)

Reliability of electrical interconnects /
by: DeVoto, Douglas
Published: (2014)

Full-wave surface integral equation method for electromagnetic-circuit simulation of three-dimensional interconnects in layered media /
by: Karsilayan, Nur
Published: (2011)

Design of 3D integrated circuits and systems /
Published: (2015)

Nano-interconnect materials and models for next generation integrated circuit design /
Published: (2024)

IC interconnect analysis /
by: Celik, Mustafa, 1966-
Published: (2002)

Electromigration in thin films and electronic devices : materials and reliability /
Published: (2011)

Three-dimensional molded interconnect devices (3D-MID) : materials, manufacturing, assembly, and applications for injection molded circuit carriers /
by: Franke, Jörg, Dipl.-Ing
Published: (2014)

Through-Silicon Vias for 3D Integration /
by: Lau, John H.
Published: (2013)