Wireless interface technologies for 3D IC and module integration /

Bibliographic Details

Main Authors:	Kuroda, Tadahiro (Author), Yip, Wai-Yeung (Author)
Corporate Author:	Cambridge University Press
Format:	eBook
Language:	English
Published:	Cambridge, United Kingdom ; New York, NY : Cambridge University Press, [2021]
Subjects:	Interconnects (Integrated circuit technology) Three-dimensional integrated circuits. Optical interconnects. Electronic books.
Online Access:	Connect to the full text of this electronic book