APA (7th ed.) Citation

Kuroda, T., & Yip, W. (2021). Wireless interface technologies for 3D IC and module integration. Cambridge University Press.

Chicago Style (17th ed.) Citation

Kuroda, Tadahiro, and Wai-Yeung Yip. Wireless Interface Technologies for 3D IC and Module Integration. Cambridge, United Kingdom ; New York, NY: Cambridge University Press, 2021.

MLA (9th ed.) Citation

Kuroda, Tadahiro, and Wai-Yeung Yip. Wireless Interface Technologies for 3D IC and Module Integration. Cambridge University Press, 2021.