Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability /

Bibliographic Details
Corporate Author: ScienceDirect (Online service)
Other Authors: Suganuma, Katsuaki (Editor)
Format: eBook
Language:English
Published: Duxford, United Kingdom : Woodhead Publishing is an imprint of Elsevier, [2018]
Series:Woodhead Publishing series in electronic and optical materials.
Subjects:
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Call Number: TK7871.85 .W53 2018
 
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TK7871.85 .W53 2018 Available