Cover Image

Advances in CMP/polishing technologies for the manufacture of electronic devices /

Show other versions (3)
Bibliographic Details
Corporate Author: Knovel (Firm)
Other Authors: Doi, Toshiro K., 1947-, Marinescu, Ioan D., Kurokawa, Syuhei
Format: eBook
Language:English
Published: Oxford : Elsevier, 2012.
Edition:1st ed.
Subjects:
Grinding and polishing.
TECHNOLOGY & ENGINEERING > Technical & Manufacturing Industries & Trades.
Electronic books.
Online Access:Connect to the full text of this electronic book
Show all versions (4)