Advances in CMP/polishing technologies for the manufacture of electronic devices /

Bibliographic Details
Corporate Author: Knovel (Firm)
Other Authors: Doi, Toshiro K., 1947-, Marinescu, Ioan D., Kurokawa, Syuhei
Format: eBook
Language:English
Published: Oxford : Elsevier, 2012.
Edition:1st ed.
Subjects:
Online Access:Connect to the full text of this electronic book
Description
Abstract:CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover.
Item Description:Electronic resource.
Physical Description:1 online resource (xii, 317 pages) : illustrations, color portraits
Bibliography:Includes bibliographical references and index.
ISBN:9781437778601
1437778607