Handbook of multilevel metallization for integrated circuits : materials, technology, and applications /

It is widely recognized that the successful design, development, and integration of multilevel metallization (MLM) systems is and will continue to be key to current and future VLSI technologies. All major semiconductor companies have significant ongoing research teams focused in this area. These tea...

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Bibliographic Details
Corporate Author: Knovel (Firm)
Other Authors: Wilson, Syd R., Tracy, Clarence J., Freeman, John L.
Format: eBook
Language:English
Published: Park Ridge, N.J. : Noyes Publications, [1993]
Series:Materials science and process technology series. Electronic materials and process technology.
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Call Number: TK7874 .H3493 1993eb
 
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TK7874 .H3493 1993eb Available