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Field guide to optical lithography /

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The material in this Field Guide is a distillation of material put together by Chris Mack over the past 20 years, including notes from his graduate-level lithography course at the University of Texas at Austin. This Field Guide details the lithography process, image formation, imaging onto a photore...

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Bibliographic Details
Main Author: Mack, Chris A.
Corporate Author: Society of Photo-optical Instrumentation Engineers
Format: eBook
Language:English
Published: Bellingham, Wash. (1000 20th St. Bellingham WA 98225-6705 USA) : SPIE, 2006.
Series:SPIE field guides ; FG06.
Subjects:
Integrated circuits > Design and construction.
Microlithography.
Electronic books.
Online Access:Connect to the full text of this electronic book
Table of Contents:
  • Diffusion in chemically amplified resists
  • Acid loss mechanisms
  • Post-apply bake effects
  • Photoresist development kinetics
  • Surface inhibition
  • Developer temperature and concentration
  • The development path
  • Lithography control and optimization
  • NILS : the normalized image log-slope
  • NILS : the log-slope defocus curve
  • NILS : image optimization
  • NILS : exposure optimization
  • NILS : PEB optimization
  • NILS : development optimization
  • NILS : total Process optimization
  • Defining photoresist linewidth
  • Critical dimension control
  • Critical dimension control : effect on devices
  • Overlay control
  • Line edge roughness
  • Metrology : critical dimension
  • Metrology : overlay
  • The process window
  • Depth of focus
  • Resolution
  • Rayleigh criteria : resolution
  • Rayleigh criteria : depth of focus
  • Mask error enhancement factor (MEEF)
  • Resolution enhancement technologies
  • Phase-shift masks
  • Phase-shift masks : alternating
  • Phase-shift masks : attenuated
  • Optical proximity effects
  • Optical proximity correction (OPC)
  • Off-axis illumination
  • Lithography simulation
  • Moore's law
  • Next-generation lithography (NGL)
  • Equation summary
  • Glossary
  • Index.
  • Symbol glossary
  • The lithography process
  • Definition : semiconductor lithography
  • Overview of the lithography Process
  • Processing : substrate preparation
  • Processing : photoresist spin coating
  • Processing : post-apply bake
  • Processing : alignment and exposure
  • Processing : post-exposure bake
  • Processing : development
  • Processing : pattern transfer
  • Image formation
  • Maxwell's equations : the mathematics of light
  • The plane wave and the phasor
  • Basic imaging theory
  • Diffraction
  • Fraunhofer diffraction : examples
  • The numerical aperture
  • Fourier optics
  • Spatial coherence and oblique illumination
  • Partial coherence
  • Aberrations
  • Aberrations : the Zernike polynomial
  • Aberrations : Zernike examples
  • Chromatic aberration
  • Horizontal-vertical (H-V) bias
  • Defocus
  • Flare
  • Vector nature of light
  • Polarization
  • The optical invariant
  • Immersion lithography : resolution
  • Immersion lithography : depth of focus
  • Imaging into a photoresist
  • Standing waves: definition
  • Standing waves: mathematics
  • Fresnel reflectivity
  • Swing curves
  • Top antireflective coatings (TARC)
  • Bottom antireflective coatings (BARC)
  • Photoresist chemistry
  • Novolak/DNQ resists
  • Chemically amplified resists
  • Absorption of light
  • Photoresist bleaching and the Dill parameters
  • Exposure kinetics
  • Measuring the Dill ABC parameters
  • Chemically amplified resist kinetics.