3D IC devices, technologies, and manufacturing /
This book discusses the advantages of 3D devices and their applications in dynamic random access memory (DRAM), 3D-NAND flash, and advanced-technology-node CMOS ICs. Topics include the development of DRAM cell transistors and storage node capacitors; the manufacturing process of advanced buried-word...
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| Format: | eBook |
| Language: | English |
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Bellingham, Washington (1000 20th St. Bellingham WA 98225-6705 USA) :
SPIE,
2016.
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| Series: | SPIE Digital Library.
SPIE monograph ; PM265. |
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| Online Access: | Connect to the full text of this electronic book |
| Summary: | This book discusses the advantages of 3D devices and their applications in dynamic random access memory (DRAM), 3D-NAND flash, and advanced-technology-node CMOS ICs. Topics include the development of DRAM cell transistors and storage node capacitors; the manufacturing process of advanced buried-word-line DRAM; 3D FinFET CMOS IC devices; scaling trends of CMOS logic; devices that may be used in the "post-CMOS" era; and 3D technologies, such as the 3D-wafer process integration of silicon-on-ILD and TSV-based 3D packaging. |
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| Item Description: | "SPIE Digital Library."--Website. |
| Physical Description: | 1 online resource (204 pages). Also available in print version. |
| Format: | Mode of access: World Wide Web. System requirements: Adobe Acrobat Reader. |
| Bibliography: | Includes bibliographical references and index. |
| ISBN: | 9781510601475 |
| DOI: | 10.1117/3.2234473 |
| Access: | Restricted to subscribers or individual electronic text purchasers. |