3D IC devices, technologies, and manufacturing /

This book discusses the advantages of 3D devices and their applications in dynamic random access memory (DRAM), 3D-NAND flash, and advanced-technology-node CMOS ICs. Topics include the development of DRAM cell transistors and storage node capacitors; the manufacturing process of advanced buried-word...

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Bibliographic Details

Main Author:	Xiao, Hong, 1961- (Author)
Format:	eBook
Language:	English
Published:	Bellingham, Washington (1000 20th St. Bellingham WA 98225-6705 USA) : SPIE, 2016.
Series:	SPIE Digital Library. SPIE monograph ; PM265.
Subjects:	Three-dimensional integrated circuits. Electronic books.
Online Access:	Connect to the full text of this electronic book