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Influence of cooling hole geometry and material conductivity on the thermal response of cooled silicon nitride plate /

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Bibliographic Details
Main Authors: Abdul-Aziz, Ali (Author), Bhatt, Ramakrishna T. (Author), Girgis, Morris (Author)
Corporate Authors: United States. National Aeronautics and Space Administration (sponsoring body.), NASA Glenn Research Center
Format: Government Document eBook
Language:English
Published: Cleveland, Ohio : National Aeronautics and Space Administration, Glenn Research Center, November 2002.
Series:NASA technical memorandum ; 2002-211688.
Subjects:
Ceramics.
Finite elements.
Silicon nitrides.
Thermal stresses.
Thermal conductivity.
Online Access:https://purl.fdlp.gov/GPO/gpo61347
Description
Item Description:Title from title screen (viewed Sept. 29, 2015).
"November 2002."
"Prepared for the 26th Annual International Conference on Advanced Ceramics and Composites sponsored by the American Ceramic Society, Cocoa Beach, Florida, January 13-18, 2002."
Physical Description:1 online resource (9 pages) : color illustrations.
Bibliography:Includes bibliographical references (page 5).