Influence of cooling hole geometry and material conductivity on the thermal response of cooled silicon nitride plate /

Bibliographic Details

Main Authors:	Abdul-Aziz, Ali (Author), Bhatt, Ramakrishna T. (Author), Girgis, Morris (Author)
Corporate Authors:	United States. National Aeronautics and Space Administration (sponsoring body.), NASA Glenn Research Center
Format:	Government Document eBook
Language:	English
Published:	Cleveland, Ohio : National Aeronautics and Space Administration, Glenn Research Center, November 2002.
Series:	NASA technical memorandum ; 2002-211688.
Subjects:	Ceramics. Finite elements. Silicon nitrides. Thermal stresses. Thermal conductivity.
Online Access:	https://purl.fdlp.gov/GPO/gpo61347