Cover Image

Non-destructive damping measurement for wafer-level packaged microelectromechanical system (MEMS) acceleration switches /

Bibliographic Details
Main Authors: Knight, Ryan (Author), Cheng, Evan (Author)
Format: Government Document eBook
Language:English
Published: Adelphi, MD : Army Research Laboratory, September 2014.
Series:ARL-TR (Aberdeen Proving Ground, Md.) ; 7094.
Subjects:
Microelectromechanical systems.
Microelectronic packaging.
Semiconductor wafers.
Online Access:https://purl.fdlp.gov/GPO/gpo61207
http://purl.fdlp.gov/GPO/gpo61207
Description
Item Description:Title from title screen (viewed Sept. 29, 2015).
"September 2014."
Physical Description:1 online resource (v, 29 pages) : color illustrations.
Bibliography:Includes bibliographical references (page 26).