Non-destructive damping measurement for wafer-level packaged microelectromechanical system (MEMS) acceleration switches /

Bibliographic Details

Main Authors:	Knight, Ryan (Author), Cheng, Evan (Author)
Format:	Government Document eBook
Language:	English
Published:	Adelphi, MD : Army Research Laboratory, September 2014.
Series:	ARL-TR (Aberdeen Proving Ground, Md.) ; 7094.
Subjects:	Microelectromechanical systems. Microelectronic packaging. Semiconductor wafers.
Online Access:	https://purl.fdlp.gov/GPO/gpo61207 http://purl.fdlp.gov/GPO/gpo61207